CPU Silicone HeatSink Thermal Paste Compound / High Temperature Heat transfer Compound 1g

HeatSink Thermal Paste Compound, often referred to as thermal grease, thermal paste, or thermal compound, is a thermally conductive material used to improve the heat transfer between a heat-generating component (like a CPU or GPU) and a heat sink.

Key Features:

*Thermal Conductivity:
**The primary function of thermal paste is to fill the microscopic gaps and imperfections between the surfaces of the CPU/GPU and the heat sink, ensuring better thermal conductivity.
**High-quality thermal pastes have better thermal conductivity, measured in watts per meter-kelvin (W/m·K).

*Composition:
**Typically composed of thermally conductive materials suspended in a binder or liquid matrix.
**Common materials include metal oxides, silicon, or ceramic particles. Some high-end thermal pastes use silver or other conductive metals for better performance.

*Viscosity and Spreadability:
**The paste must be thick enough to stay in place, but also spreadable enough to form a thin, even layer when pressure is applied.

*Non-Curing:
**Most thermal pastes are non-curing, meaning they remain pliable and do not harden over time, ensuring consistent thermal conductivity.

Applications:

*Computers:
**Used between the CPU or GPU and their respective heat sinks to enhance cooling efficiency and prevent overheating.

*Electronics:
**Applied to power transistors, voltage regulators, and other heat-generating components that require effective thermal management.

*LED Lighting:
**Used in high-power LED assemblies to dissipate heat and extend the life of the LEDs.